This study has a certain reference value for improving the reliability of lead-free plastic ball grid array chip. 本文的研究对于提高无铅塑封球栅阵列芯片可靠性具有一定的参考意义。
Simulation results indicate that the maximum points of the stress and strain are all in the non-uniform distribution part of the lead-free plastic ball grid array device. 模拟结果表明,无铅球栅阵列(LFBGA)封装器件上的应变、应力最大点均发生在焊球分布不均匀处。
Leaded and lead-free BGA ( ball grid array ) components were tested in board level drop test defined in the JEDEC ( Joint Electron Device Engineering Council ) standard. 按照JEDEC标准对板级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。