High Density and High Performance Electronic Package Technology 高密度高性能电子封装技术
Along with BGA package development and applying widely, it is believed that BGA will be the best choice of high density, high performance and multiple functional package style. 随着BGA封装的发展和广泛应用,其将成为高密度、高性能、多功能封装的最佳选择。
Based on PE-mLLD, PIB and white opaque masterbatches, co-extruded CPP multilayer film with high performance for the wrap package of herbage was produced on co-extruded CPP multilayer film line. 使用PEmLLD、增粘母料、增白遮光母料在多层共挤流延膜生产线上制备出高性能的多层共挤流延牧草缠绕膜。
This paper describes the concept, characteristic and process of Multi-layer Thin-Substrate ( MLTS ) package technology, and developed high performance FCBGA and CSP using MLTS package technology. 概述了超高密度薄型基板(MLTS)封装技术的概念、特征和工艺以及应用MLTS封装技术开发的高性能FCBGA和CSP。
With the rapid development of electronic information systems to multifunction, miniaturization, and low cost etc., there are more and more urgent demands on high performance miniaturized microwave passive components for system on package ( SoP ) technology. 随着电子信息系统向多功能、小型化、低成本方向快速发展,人们对系统级封装(SystemonPackage,SoP)中各类高性能小型化微波无源元件的需求越来越强烈。