We are on third step now, many companies are developing Chip Scale Package ( CSP ) System In Package ( SIP ), Wafer Level Scale Package ( WLSP ) etc to get the highest density. 晶片级封装、系统封装、芯片级封装是现在第三次革新的产物,其目的就是将封装减到最小。
A Wafer Level Chip Scale Package & MicroSMD 晶圆级芯片规模封装&微型表面贴装元器件
Study on Wafer - level Chip Scale Package for MEMS MEMS圆片级芯片尺寸封装研究