So a method to eliminate the bulk scattering in measuring transparent substrate surface is needed. 所以,在透明基片的表面散射测试中,急需找到消除体散射对表面散射影响的行之有效的方法。
LED wafer bonding, the attachment of LED epitaxial wafer to another substrate such as GaP transparent substrate, metal mirror substrate or sapphire substrate, increases the light emitting efficiency. LED晶片键合技术可以把LED外延片和GaP透明衬底、金属镜面衬底或蓝宝石衬底结合以提高出光效率。
Apparent emitting properties of a semi transparent medium layer with specular semi transparent surface and diffuse substrate 具有半透明镜反射表面和不透明漫射基底面的半透明介质层的表观光谱发射特性
The finite element model of the thermal conductive equation and the thermo-elastic equation in the system consisting of a transparent coating and a opaque substrate is established based on the analysis of the stability of solution and two important parameters, meshing size and time step. 在分析了网格大小和时间步长这两个重要参数和求解稳定性的基础上,采用有限元方法建立了透明薄膜/基底系统的热传导方程和热弹性方程的有限元模型。
Effects of Sputtering Argon Partial Pressure on Photoelectric Properties of Transparent Conducting ITO Films Deposited on Flexible Substrate 溅射氩分压对ITO透明导电薄膜光电特性的影响