The research in this thesis is supported by the National Natural Science Foundation Project. The structure and dimension parameters of Quad Flat no-lead package ( QFN ) devices has been optimized and analyzed. 本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法,对四方扁平无引脚封装(QFN)器件进行了结构尺寸参数优化和分析。
The QFN package ( Quad Flat No-lead Package ), a new and developing technology for chip package, is a small footprint, low profile, surface mount, plastic encapsulated package with leads on the bottom. QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。
Quad Flat No-lead ( QFN ) package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly. QFN封装的微波芯片采用一种较新的封装形式,这种封装体积很小,特别适合高密度印刷电路板组装。