This paper decries the development trends of multi-layer varistor in recent years, including ceramic material ( grain sign, great chip thickness ) internal electrode material stack structure and surface processing and so on. 从构成叠层压敏电阻器的生片材料(材料晶粒大小、生片厚度)、内电极材料、叠层结构和表面处理等诸方面,介绍叠层压敏电阻器的近期研制动向。