Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ). 采用微焊点强度测试仪(STR-1000型)测试了方形扁平式封装器件(QFP)的抗拉强度,并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。
Then implement rapid component partition basing it. By means of the grayscale inertia moment theory, this system calculate chip rotation angle through the contour information of SOP ( Small Outline Package(SOP) ) chips. 利用SOP(小尺寸封装)芯片的外形轮廓信息,在灰度惯性矩基础上实现了芯片偏角检测。