Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system ( MEMS ) products. 微胶接技术非常适用于微机电系统(MEMS)产品的自动化装配过程。
The development of MEMS ( Micro-electro-mechanical system ) technology brings up brand-new methods in designing and fabricating optical devices. MEMS技术的迅猛发展,给传统光学器件的设计和制造带来了全新的思路。
RF MEMS ( Radio-Frequency Micro-Electro-Mechanical System(MEMS) ) component achieves RF performance by mechanical movement or vibration. 射频微机电系统(MEMS)(简称RFMEMS)通过机械移动或振动实现了射频电子器件的功能。
Furthermore, the micro-electro-mechanical system ( MEMS ) sensor could be compatible with integrated circuit technology. 而且这种基于微机电系统(MEMS)技术的传感器与集成电路工艺是兼容的。
Advances in micro-electro-mechanical system technology, wireless communications technology and computer technology have enabled the development of low-power, low-cost, multifunctional micro-sensor nodes, and then promoting wireless sensor networks for rapid development. 微机电系统(MEMS)、无线通信技术和计算机技术等的发展促进了低功耗、低代价和多功能的微型传感器制造技术的产生和发展,进而推动了无线传感器网络的飞速发展。