Impedance Controlling Printed Wiring Board(PWB) Design Technology for High Frequency Electronic Machine 适用于高频电子机器的阻抗控制印制线路板设计技术
The Questions in Designing Printed Wiring Board(PWB) and the Solutions 设计印制线路板应注意问题及解决方法
This paper analyses some details in different phases of designing printed wiring board and correct designing steps also introduces some possible questions of laying lines, various noises and the solutions. 分析在印制线路板设计各个阶段中应注意的细节和正确的设计步骤,给出可能遇到的布线问题,噪声种类及其解决方法。
Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board ( PWB ) that make such high-density packaging possible are making greatly progress. 以CSP为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。