Study on thermoplastic polyimide modified by glass bead 玻璃微珠改性热塑性聚酰亚胺(TPI)研究
Research on Thermal Conductivity of Thermoplastic Polyimide Composites 热塑性聚酰亚胺(TPI)复合材料导热性能研究
The effects of glass bead content and its size on the mechanical property of thermoplastic polyimide ( PI-T ) modified by glass bead were considered. The coefficient of thermal expansion was measured by thermal mechanical analyzer ( TMA ). 采用玻璃微珠改性热塑性聚酰亚胺(TPI)(PIT),考察了玻璃微珠粒径和用量对PIT力学性能的影响,并用热机械分析仪(TMA)测定了改性PIT的线胀系数。