With the development of thin small outline electronic product, the technology of electronic packaging is more important gradually. 在电子产品集成化程度高且小、轻、薄的发展趋势影响下,电子封装技术日趋重要。
In this article, different combinations of finite element and calculating methods were used to investigate the best method for predicting the thin small outline packages ( TSOP ) warpage. 把有限元和各种计算方法进行不同地结合,是研究预测薄型小外形封装(TSOP)翘曲问题的最佳方法。
Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ). 采用微焊点强度测试仪(STR-1000型)测试了方形扁平式封装器件(QFP)的抗拉强度,并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。
Then implement rapid component partition basing it. By means of the grayscale inertia moment theory, this system calculate chip rotation angle through the contour information of SOP ( Small Outline(SO) Package ) chips. 利用SOP(小尺寸封装)芯片的外形轮廓信息,在灰度惯性矩基础上实现了芯片偏角检测。
With the simple structure, small outline and friendly interface, this spectrometer is particularly suitable for the rapid determination of environment monitoring and food safety. 3. 仪器结构简单、体积小、使用方便,因而可以满足环境与食品安全现场快速检测对仪器的要求。