Another focus was on how the operating parameters affect the ultrasonic wire bonding. 分析了各工作参数对超声波线焊产生的影响。
Finally, wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design. 最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
Metal wire bonding interconnection is the key means in the internal matching technology of RF power transistor. 金属键合线互连是射频大功率晶体管内匹配技术中的关键手段。
Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding(W/B) System 超声振动在引线键合(W/B)系统中的传播仿真与研究
Design of High-frequency Ultrasonic Transducer for Wire Bonding(W/B) and Research on Motion Control of Bond Head 引线键合(W/B)高频超声换能器的设计和键合头运动控制研究