The Problem About Stress Migration(SM) in the VLSI Manufacture 关于超大规模集成电路制造中的应力迁移(SM)问题
It indicates that under temperature load, stress migration can occur in the solder joints. 用模拟仿真的方法得出了在温度载荷下,应力迁移(SM)会在焊点上发生。
In many issues of the reliability of copper interconnection, we place the emphasis on electromigration and stress migration. 在铜互连可靠性的几个主要问题中,重点针对互连中的电迁徙和应力迁徙进行了探讨。
The stress migration is one of defect that determines metal routing reliability in the IC manufacture. 应力迁移(SM)是影响集成电路(IC)金属配线可靠性的缺陷之一。
Adding alloy elements in pure aluminum can improve the properties ( Such as stress migration, electricity migration ) of the sputter film. But it also causes the concentration to distribute nonuniformly. 在纯铝中加入合金元素,可以改善溅射薄膜的一些不良性能,如应力迁移(SM)和电迁移,但合金元素的加入给铸锭成分均匀性的控制带来了一定的难度。