Tensile strength of the quad flat pack ( QFP ) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package ). 采用微焊点强度测试仪(STR-1000型)测试了方形扁平式封装器件(QFP)的抗拉强度,并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。
Soldering technology for quad flat pack devices ( QFP ) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power. 采用90W半导体激光软钎焊系统对方形扁平式封装器件(QFP)进行了焊接试验研究,并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。
The Research Study of Ceramic Quad Flat Pack(QFP) 陶瓷四边引线扁平外壳工艺研究