Process of Three-proofing Coating and Coating Removal of Printed Circuit Assembly(PCA) 印制板组件的三防涂覆及其去除工艺
Quad Flat No-lead ( QFN ) package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly. QFN封装的微波芯片采用一种较新的封装形式,这种封装体积很小,特别适合高密度印刷电路板组装。
As an investigation result, a measurement method for passive parts on the printed circuit assembly board ( PCA ) is summarized. 总结了电路板上无源器件非焊下精确测量的方法。
Optimization of Printed Circuit Board Assembly Scheduling and Its Applications for a Large Parallel System 印刷电路板大型并行系统的表面贴装调度优化及其实证研究
Job Shop Printed Circuit Board Assembly Optimization Based on Model Constrainted by Polychromatic Sets 基于多色集合约束模型的车间层印刷电路板组装优化