Reliability Research on Solder Joint of Plastic Ball Grid Array(PBGA) Component PBGA器件焊点的可靠性分析研究
Research of thermal stress and analysis of thermal characteristic for plastic ball grid array package PBGA封装热应力研究与热特性分析
This study has a certain reference value for improving the reliability of lead-free plastic ball grid array chip. 本文的研究对于提高无铅塑封球栅阵列芯片可靠性具有一定的参考意义。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array ( PBGA ) component. 基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
Based on the theory of thermal elasticity mechanics and structural optimization, the models of finite element numerical simulation for thermo-mechanical analysis of a plastic ball grid array ( PBGA ) package design are established. 基于热弹性力学和结构优化理论,针对典型的PBGA封装体在工作过程中的受热问题,建立了有限元数值模拟分析模型。