Warpage of Three-Dimensional Multi-Chip Module(MCM) Based on Embedded Substrate 基于埋置式基板的三维多芯片组件的翘曲研究
MCM ( Multi-Chip Module(MCM) ) is presently the most effective method for realizing the miniaturization of airborne radar receiver front-end. 多芯片组件(MCM)是目前实现机载雷达接收前端小型化的最有效途径。
Performance of a silicon-based embedded MMCM package Development of a Miniature T / R Front-end Using Microwave Multi-Chip Module(MCM) Technology 一种硅埋置型微波多芯片组件封装的电性能基于多芯片组装技术的小型微波收发前端研制
Development of a Miniature T / R Front-end Using Microwave Multi-Chip Module(MCM) Technology 基于多芯片组装技术的小型微波收发前端研制
The Research of RF Front-End Applied for Satellite Navigation Communication Handset; Development of a Miniature T / R Front-end Using Microwave Multi-Chip Module(MCM) Technology 用于卫星导航定位通信机的射频收发前端研究基于多芯片组装技术的小型微波收发前端研制