Parameter and Trend Analysis on Electromigration Acceleration Model 电迁移(EM)加速测试模型参数分析及其趋势研究
The different temperature generates the difference of atomic fluxes and IMCs growth rates at the cathode, which also causes the nonuniform electromigration degree in different solder joints. 不同焊点的温度差异引起了阴极界面的原子净流量和IMC的生长速率差异,导致不同焊点的电迁移(EM)程度差异。
Research of Electromigration Simulation Algorithm with Considering Multiple Migration Mechanisms and Sensitivity Analysis 考虑多种迁移机制的电迁移(EM)仿真算法研究及灵敏度分析
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging 倒装芯片技术中无铅凸点电迁移(EM)研究
A novel structure has been designed and applied in metallization system of microwave power device, in which backflow effect is taken to increase the electromigration resistance. 在回流动力学理论和实验研究的基础上,将回流加固结构应用于实际微波功率器件。