Basic structure and classification of chip scale package are summarized in this paper, and its excellent merits are also indicated by comparison with traditional packaging styles. At last, new applications and development foreground of CSP are introduced through some examples. 概述了芯片尺寸封装(CSP)的基本结构和分类,通过与传统封装形式进行对比,指出了CSP技术具有的突出优点,最后举例说明了它的最新应用,并展望了其发展前景。
Chip scale package ( CSP ) is a new microelectronic packaging technology rapidly deve - loped in recent years. 芯片尺度封装(CSP)技术是近年来发展最为迅速的微电子封装新技术。
Study on Wafer - level Chip Scale Package(CSP) for MEMS MEMS圆片级芯片尺寸封装研究
Stress analysis on gold wire of chip scale package 芯片尺度封装中焊线的应力分析研究
A Summary of the Process Technology for Chip Scale Package(CSP) 芯片尺寸封装工艺技术