It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc. 该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列(BGA)中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
FC-BGA Flip-Chip Ball Grid Array(BGA) From there rose the rattle and chatter and whistling. 反转芯片球形栅格阵列那儿发出一阵阵格格声、人语声和哨声。
Study on Stress-Strain and Thermal Failure of Ball Grid Array(BGA) Package 球栅阵列(BGA)封装的应力应变及热失效研究
Integrated life prediction method of ball grid array soldered joint 球栅阵列(BGA)封装焊点寿命预测的综合方法
Reliability Research on Solder Joint of Plastic Ball Grid Array(BGA) Component PBGA器件焊点的可靠性分析研究